JIS Z Test methods for flat pallets (FOREIGN STANDARD). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. Standard (JIS Z ) was performed. From the obtained results, the possibility of practical application was exam- ined. Moreover, the manufacturing process of. JIS Z – JIS Z Test methods for flat pallets. Publication date: ; Original language: English. Please select.

Author: Samushura Kakree
Country: Turkey
Language: English (Spanish)
Genre: Relationship
Published (Last): 9 September 2005
Pages: 168
PDF File Size: 11.5 Mb
ePub File Size: 4.41 Mb
ISBN: 532-8-38394-753-7
Downloads: 97439
Price: Free* [*Free Regsitration Required]
Uploader: Fausar

In chemical reactions, if molecules reach the temperature above which they may react the activation energya reaction occurs. The fundamental condition of the Bernoulli trial is that results are only two types and they are definitely identified. We will not discuss the correctness of this in a strict mathematical sense.

We can find a relation between the Pascal distribution and the binomial distribution if we interpret the Pascal distribution as a Bernoulli trial comprising n – 1 tests with phenomenon 1 invariably occurring at the last n-th time after x – 1 002 of phenomenon 1.

This discrete model is termed the Bernoulli trial or sampling. Chapter 5 – Basic Concepts of Probability. Since the location of the dust particles on the wafer surface is unpredictable, we can assume that mask defects occur completely at r random.

A.1 AQL Sampling Table

This, however, is not equivalent to saying the device lifetime is hours. By considering the probability of detecting the first failure at time t, the relation of exponential and geometric distributions can be identified. The double exponential distribution is suitable for analysis of such kis of phenomena. We cannot expect that there will be no collision for some time since one has just occurred. This will be illustrated later in section C, “Relations of Probability Distributions.


If the number of defective devices x detected in a sample of n devices does not exceed c, the entire lot is considered to have passed R inspection. This model consists of m units connected in series, which i-th unit has ni devices connected in parallel. Unless otherwise specified, use Inspection Standard II. The relationship between activation energy and the acceleration factor is shown in figure B.

Subsequent lots are, however, subject to normal inspection. Arrhenius expressed the chemical reaction rate, K, experimentally as follows: If we take this current i as the device characteristic Jjis discussed in B.

A.1 AQL Sampling Table

Wear-outfailures which almost suddenly outbreak after a certain period approximate the normal distribution. It is important to note that N no longer denotes the number of tests of Bernoulli trial due to the approximation of the binomial probability distribution to the Poisson distribution. This is consistent with the fact that the geometric and exponential distributions are discrete and continuous distributions, respectively IX Let us assume that the device will fail when the characteristic value changes to XL.

As time t passes, the failure rate of these semiconductor devices changes. Each test result is independent from one another. Regular versus Military Time. Number of pieces rejected. For the system in figure B. We deal with this issue in B. Similarly, we cannot say that a cosmic ray will soon collide with a semiconductor device because there have been no collisions for a moment.

IX Thus understanding the Poisson distribution in different ways we can clarify its relations with other probability distributions. For studying the change, in this model, probabilities of individual devices failing by the time t are jiis p tand the probability that at least one of the n devices will fail is F t. Values in parentheses indicate the minimum quality required to have 19 out of 20 lots pass on average. The part of the device which is most susceptible to the applied stress will be the most damaged and will eventually fail.


For ease of understanding we have chosen “failure” and “no failure” for results 1 and 2respectively.

This is because the denominator of the defining expression equation IX 00602 hours does not refer to any particular device. Scale palameter Refer to Figure B. Moreover, we consider the system in figure B.

Use first sampling plan above arrow. MTBF known after the life of equipment is of no practical use.

JIS Z – Test methods for flat pallets (FOREIGN STANDARD)

Use first sampling plan below arrow. The initial value for starting the trial is 0 and we perform N tests.

The reaction rate K using this model is given by the following expression: If the amount of change in the characteristic value is found to be accelerated by thermal stress, in many cases the Arrhenius chemical reaction kinetics model can be applied to this phenomenon.

Such a phenomenon occurs with some probability. In such a case, stress is applied locally to the device and the life or the withstanding limit of the device depends on its weak point. The area of the wafer surface S is divided into many portions. The possible test results are limited to either 1 “failure or defect”or 2 “no failure or acceptance,” with no possibility of such results as “pending decision” or “exception acceptance” allowed.